BERATRONIC

IC substrate PCBs

Discover with us the innovative link between conventional PCBs and semiconductors that sets new standards and raises your electronic products to a new level.
Immerse yourself in the world of miniaturization and precision and be inspired by our tailor-made solutions for your most demanding electronic applications

Our portfolio

APPLICATIONS

The future of electronics: Innovative design with IC substrate PCBs from BERATRONIC

BERATRONIC’s IC substrate PCBs are the innovative link between conventional PCBs and semiconductors, with a focus on miniaturization.
The technology aims to realize features that were considered unattainable in PCB manufacturing just a few years ago, using an approach reminiscent of methods used in the semiconductor industry 5 to 10 years ago.

Structure and function: Our IC substrate PCBs are made of high-quality materials and are specially developed to meet the requirements of the latest electronic applications.
Their precise construction and advanced technology ensure reliable performance and a long service life for your products.

High-performance computer

IC substrate PCBs are essential for high-performance computers as they enable the assembly of high-performance ICs while ensuring efficient heat dissipation.
This is crucial for the performance and reliability of servers, workstations and other high-end computer systems.

Mobile devices

In mobile devices such as smartphones and tablets, IC substrate PCBs are used to optimize the placement and connection of ICs.
Thanks to their precise design and heat dissipation, they help to improve the performance and service life of mobile electronic devices.

Automotive industry

In the automotive industry, IC substrate PCBs are used for various applications, including vehicle control systems, infotainment systems and driver assistance technologies.
Their reliability and heat dissipation capabilities make them the ideal choice for demanding automotive applications.

Our IC substrate PCBs are versatile and play a crucial role in the performance and reliability of modern electronic devices.
They are used in consumer electronics, e.g. in high-definition televisions and gaming consoles, in aerospace for controlling satellites and drones, and in medical technology, where they ensure maximum precision and reliability in imaging procedures and diagnostic devices. Whatever your industry, our IC substrate PCBs offer the perfect solution for demanding electronic applications and help ensure that your products meet the highest standards of performance, reliability and quality.

 IC Substrate PCBs	Specs
 IC Substrate PCBs Layer	Specs 2-28Layers
 IC Substrate PCBs Materials	Specs MGC, ABF, HIT, Hitachi
 IC Substrate PCBs Final Thickness	Specs 0.06-2.5mm
 IC Substrate PCBs Copper Thickness	Specs 2μm-40μm
 IC Substrate PCBs Minimum track & spacing	Specs 0.01mm / 0.01mm
 IC Substrate PCBs Max. Size	Specs FCBGA: 100 x 100mm
 IC Substrate PCBs Surface Treatments	Specs ENEPIG, IT+SOP, soft gold
 IC Substrate PCBs POFV evenness	Specs 2μm
 IC Substrate PCBs Minimum Hole	Specs 50μm
 IC Substrate PCBs Minimum BGA	Specs 110μm
 IC Substrate PCBs Minimum Mechanical Drill	Specs 0.15mm
 IC Substrate PCBs Minimum Laser Drill	Specs 0.05mm

FAQ

Answers to the most common questions about IC substrate PCBs

1. What are IC Substrate PCBs and what are they used for?

IC substrate PCBs are specialized printed circuit boards that serve as carriers for integrated circuits. They connect the chip to the system PCB, provide ultra-fine interconnections (e.g., flip-chip or wire bonding), and support both electrical performance and thermal management.

2. What advantages do IC Substrates offer compared to standard multilayer or HDI PCBs?

They provide higher interconnect density, improved heat dissipation, excellent reliability under thermal stress, better signal integrity, and enable particularly compact designs for modern high-performance electronics.

3. Which industries and applications are IC Substrates used in?

They are widely applied in semiconductor packaging, smartphones, tablets, 5G and telecom systems, high-performance computing, automotive electronics, and medical devices – wherever miniaturization and performance are critical.

4. What materials are used in IC Substrate manufacturing?

Common materials include BT resin, ABF build-up films, high-TG resins, and ceramics such as aluminum oxide or aluminum nitride. These materials offer a high glass transition temperature (Tg), low coefficient of thermal expansion (CTE), and good thermal conductivity.

5. What are typical technical specifications of IC Substrates?

Typical specifications include ultra-fine line/space down to 20–30 µm, laser-drilled microvias, very thin overall thicknesses, and advanced surface finishes such as ENIG or ENEPIG. Depending on the design, 2–6 layers are common, with higher counts for more complex ICs.

6. How are IC Substrates manufactured?

The process involves material preparation, laser drilling of microvias, copper plating and via filling, photolithographic patterning, electroplating, surface finishing (e.g., ENIG, ENEPIG), and extensive testing such as AOI, electrical testing, and X-ray inspection.

7. What challenges are associated with IC Substrate manufacturing?

Key challenges include controlling warpage in thin substrates, ensuring microvia reliability, precise layer alignment, uniform copper plating, and balancing high product quality with cost-effective manufacturing.