BERATRONIC

HDI PCBs

Experience a revolution in electronics with BERATRONIC’s HDI PCBs.
With their remarkable packing density and finer structures, they offer unrivaled space savings and performance.
This advanced technology enables the integration of more components in a smaller space, resulting in improved signal integrity and efficiency.
Our customized HDI solutions are the preferred choice in industries such as telecommunications, medical, aerospace and high-end consumer electronics.

Applications

Revolutionary HDI PCBs: Highest performance and efficiency combined in a compact design

HDI PCBs, or High Density Interconnect PCBs, are characterized by a particularly high packing density of components and finer structures compared to conventional PCBs.
The use of this advanced technology makes it possible to save space, reduce the number of layers and improve the performance of electronic circuits.

The finer structures allow more components to be integrated in a smaller space, resulting in improved signal integrity and more efficient electronics.
HDI PCBs are classified according to the IPC 2226 standard, more precisely the “Sectional Design Standard for High Density Interconnect (HDI) Printed Boards”.
This standard divides HDI designs into types from “I” to “VI”, depending on the intended use and complexity.

Telecommunications

Aerospace technology

High-end consumer electronics

Medical technology

High Density Interconnect PCBs are the key to innovation in telecommunications, medical, aerospace and high-end consumer electronics with our world-class HDI PCBs.
With their unrivaled reliability and precision, they are the ultimate choice for electronic devices that need to be both compact and powerful.
Rely on us to turn your visions into reality and take your products to the next level!

HDI PCBs

Specs

HDI PCBs

Layer

Specs

4-24 Layer

HDI PCBs

Technology Highlights

Specs

any layer can be connected, multilayer with finer lines/space, till 5 sequential laminations (N+5)

HDI PCBs

Materials

Specs

FR4, high TG FR4, low CTE, Rogers

HDI PCBs

Final Thickness

Specs

0.4 - 3.2mm

HDI PCBs

Copper Thickness

Specs

18μm - 70µm

HDI PCBs

Minimum track & spacing

Specs

0.0762 mm / 0.0762 mm

HDI PCBs

Max. Size

Specs

550 x 400mm

HDI PCBs

Surface Treatments

Specs

ENIG, HAL Leadfree, HASL, OSP, Imm.Tin, Imm. Ni/Au, Imm.Silver, Gold fingers

HDI PCBs

Minimum Mechanical Drill

Specs

0.15mm advanced 0.1mm

HDI PCBs

Minimum Laser Drill

Specs

0.10mm standard, advanced 0.075mm

FAQ

Answers to the most common questions about HDI printed circuit boards

1. What are HDI printed circuit boards and how do they differ from standard multilayer PCBs?

HDI (High Density Interconnect) PCBs feature higher wiring density, finer traces, and smaller vias (such as microvias). Compared to standard multilayer PCBs, they achieve the same functionality with fewer layers, improved signal integrity, and more compact designs.

2. What advantages do HDI PCBs offer for electronic applications?

Key benefits of HDI PCBs include space savings through compact design, improved signal transmission (shorter paths and reduced interference), lower weight, more efficient use of available space, and often lower costs in complex designs thanks to reduced layer counts.

3. Which industries particularly benefit from using HDI PCBs?

HDI PCBs are widely used in telecommunications, medical technology, aerospace, and high-end consumer electronics—sectors where reliability, miniaturization, high density, and compact form factors are critical.

4. What materials and specifications does BERATRONIC provide for HDI PCBs?

BERATRONIC supplies HDI PCBs made from materials such as FR-4, high-TG FR-4, Rogers, and other specialized substrates. Typical specifications include 4 to 24 layers, copper thicknesses from ~18 µm to ~70 µm, final board thicknesses from about 0.4 to 3.2 mm, and minimum trace/space down to ~0.0762 mm.

5. What does “sequential lamination (N+5)” mean and why is it important for HDI?

“Sequential lamination (N+5)” refers to step-by-step build-up of layer stacks, enabling via connections between arbitrary layers. This allows advanced HDI structures with multiple microvias and blind or buried vias, supporting both miniaturization and higher performance.

6. What are the limits of HDI miniaturization?

Limits are defined by manufacturing capabilities—such as the smallest achievable microvia size, minimum trace width and spacing, dielectric properties, layer count, panel size, and drilling accuracy. In addition, both cost and testing complexity increase as feature sizes shrink.

HDI PCBs from BERATRONIC

Take your electronics to the next level with BERATRONIC HDI PCBs!
Discover perfection in design and efficiency in performance.
Ready for the future?

Contact us now and let us realize your vision together!