BERATRONIC
HDI PCBs
Experience a revolution in electronics with BERATRONIC’s HDI PCBs.
With their remarkable packing density and finer structures, they offer unrivaled space savings and performance.
This advanced technology enables the integration of more components in a smaller space, resulting in improved signal integrity and efficiency.
Our customized HDI solutions are the preferred choice in industries such as telecommunications, medical, aerospace and high-end consumer electronics.
Applications
Revolutionary HDI PCBs: Highest performance and efficiency combined in a compact design
HDI PCBs, or High Density Interconnect PCBs, are characterized by a particularly high packing density of components and finer structures compared to conventional PCBs.
The use of this advanced technology makes it possible to save space, reduce the number of layers and improve the performance of electronic circuits.
The finer structures allow more components to be integrated in a smaller space, resulting in improved signal integrity and more efficient electronics.
HDI PCBs are classified according to the IPC 2226 standard, more precisely the “Sectional Design Standard for High Density Interconnect (HDI) Printed Boards”.
This standard divides HDI designs into types from “I” to “VI”, depending on the intended use and complexity.
Telecommunications
Aerospace technology
High-end consumer electronics
Medical technology
FAQ
Answers to the most common questions about HDI printed circuit boards
1. What are HDI printed circuit boards and how do they differ from standard multilayer PCBs?
2. What advantages do HDI PCBs offer for electronic applications?
3. Which industries particularly benefit from using HDI PCBs?
HDI PCBs are widely used in telecommunications, medical technology, aerospace, and high-end consumer electronics—sectors where reliability, miniaturization, high density, and compact form factors are critical.
4. What materials and specifications does BERATRONIC provide for HDI PCBs?
BERATRONIC supplies HDI PCBs made from materials such as FR-4, high-TG FR-4, Rogers, and other specialized substrates. Typical specifications include 4 to 24 layers, copper thicknesses from ~18 µm to ~70 µm, final board thicknesses from about 0.4 to 3.2 mm, and minimum trace/space down to ~0.0762 mm.