BERATRONIC
High-Frequency PCBs
High-frequency PCBs with high thermal conductivity materials – for reliable performance in demanding RF applications.
High-frequency PCBs based on high-thermal-conductivity laminates combine excellent electrical performance with effective thermal management. These specialized materials – technically referred to as High-Thermal-Conductivity RF Laminates or HTC HF materials – ensure stable impedance characteristics and efficient heat dissipation even at very high frequencies. This makes them the ideal choice for performance-critical applications such as 5G base stations, RF amplifiers, and radar electronics.
APPLICATIONS
High-frequency materials with superior thermal conductivity from BERATRONIC
BERATRONIC’s high-thermal-conductivity HF materials are specifically developed for high-power RF circuits. Typically made from PTFE or ceramic-filled substrates, they feature exceptionally low dielectric loss (Df) and high thermal conductivity – up to 1.0 W/m·K, depending on the material type.
Our HF materials combine low Dk/Df values for optimal high-frequency behavior with enhanced heat dissipation. This combination is especially valuable in high-performance RF applications, where thermal stability supports consistent electrical characteristics.
Mechanically, these laminates are designed to meet industrial requirements: they offer chemical resistance, high dielectric strength, and dimensional stability under thermal stress. Combined with advanced manufacturing technologies such as blind and buried vias, controlled impedance, or via-in-pad concepts, they enable the production of highly precise multilayer RF PCBs.
Key Advantages
Excellent heat dissipation (up to 1.6 W/m·K)
Reduced thermal management risk
Extremely low dissipation factor
Minimal RF losses
Stable dielectric constant
Accurate impedance control at high frequencies
Mechanical and thermal robustness
Suitable for harsh environmental conditions
What are Low-Loss Materials?
Low-loss materials are characterized by an exceptionally low dielectric loss factor (Df), enabling low-attenuation signal transmission even at very high frequencies. Materials such as Rogers RO4350B (standard low-loss) and RT/duroid 6035HTC or Taconic TLY-5A (both ultra-low-loss) belong to this class. They are ideal for applications requiring strict impedance control and high signal integrity, such as RF power amplifiers, radar systems, and antenna technology.
Material Overview – High-Frequency Laminates with Thermal Conductivity and Df Values at 10 GHz
| Material | Thermal Conductivity (W/m·K) | Dk (10 GHz) | Df (10 GHz) | Category | Key Features |
|---|---|---|---|---|---|
| RT/duroid® 6035HTC | 1.44 W/m·K | 3.50 ± 0.05 | 0.0013 | Ultra-Low-Loss | Very low Df, PTFE-ceramic, excellent RF performance |
| TC350 | 1.0 W/m·K | 3.50 | 0.0020 | Low-Loss | Ceramic-filled, stable impedance |
| TC600 | 1.0 W/m·K | 6.15 ± 0.15 | 0.0020 | Low-Loss | Very high thermal conductivity, RF-capable |
| RO4835T | 0.52–0.54 W/m·K | 3.48 | 0.0030–0.0037 | Thermally Stable Low-Loss | Temperature and humidity stable, RF-optimized |
| RO4350B | 0.69 W/m·K | 3.48 ± 0.05 | 0.0037 | Standard Low-Loss | Cost-effective, easy to process, FR4-like handling |
| Material | Thermal Conductivity (W/m·K) | Dk (10 GHz) | Df (10 GHz) | Category | Key Features |
|---|---|---|---|---|---|
| RT/duroid 6035HTC | 1.44 W/m·K | 3.50 ± 0.05 | 0.0013 | Ultra-Low-Loss | Very low Df, PTFE-ceramic, excellent RF performance |
| TC350 | 1.0 W/m·K | 3.50 | 0.0020 | Low-Loss | Ceramic-filled, stable impedance |
| TC600 | 1.0 W/m·K | 6.15 ± 0.15 | 0.0020 | Low-Loss | Very high thermal conductivity, RF-capable |
| RO4835T | 0.52…0.54 W/m·K | 3.48 | 0.0030…0.0037 | Thermally Stable Low-Loss | Temperature/humidity stable, RF-optimized |
| RO4350B | 0.69 W/m·K | 3.48 ± 0.05 | 0.0037 | Standard Low-Loss | Cost-effective, easy to process, FR4-like handling |
- Ventec: VT-47HTC, VT-4B
- Taconic: TLY-5A, RF-35TC
- Arlon: AD350, 25N, 85N
- Isola: IS680-345, Astra MT
- Panasonic: Megtron 6, RF-PCL
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